Morphology of Silver Particles and Films Arising from Particle‐Free Silver Ink Droplet Evaporation

Author:

Zhang Weipeng1ORCID,Yang Jun2,Knopf George K.1ORCID

Affiliation:

1. Department of Mechanical and Materials Engineering The University of Western Ontario London Ontario N6A 5B9 Canada

2. Shenzhen Institute for Advanced Study University of Electronic Science and Technology of China Shenzhen Guangdong 518110 China

Abstract

AbstractThe evaporation of particle‐free silver ink droplets on heated substrates directly impacts the morphology of the resultant silver particles and electrically conductive inkjet‐printed films. In this work, COMSOL Multiphysics simulations of the droplet evaporation process are used to help explain the fluidic processes responsible for the experimental observations. The results show that the silver particle morphology depends on its location within the evaporating droplet where large particles (3 to 5 µm) accumulate at the center and smaller ones (1 to 2 µm) in the area beyond the central region. The smallest particles (≈500 nm) are near the contact line. Without the fluoro‐surfactant FS‐31, an inner ring with 3 µm particles also appears within the evaporating droplet. The large particles at the central region originate from the fluid near the droplet's apex due to the accumulation of polyacrylamide in the concentrated ethylene glycol solvent near the flow‐abundant apex. Furthermore, the capillary flow along the fluid–air interface transports silver ions and particles throughout the droplet, causing the larger particles to fall onto the substrate at the central vortex, forming the inner ring. The simulations also demonstrate that the evaporating droplet heterogeneously accumulates ethylene glycol in a sandhill formation at the bottom center.

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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