Development of a Highly Sensitive and Stable Flexible Temperature Sensor Based on All‐Inorganic Mn–Co–Ni–O Thin Films

Author:

Song Yuxian12,Wang Shuo1,Gao Bo12,Chang Aimin123,Kong Wenwen12ORCID

Affiliation:

1. Key Laboratory of Functional Materials and Devices for Special Environments of CAS Xinjiang Key Laboratory of Electronic Information Materials and Devices Xinjiang Technical Institute of Physics and Chemistry of CAS Urumqi 830011 China

2. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing 100049 China

3. CAS Sensor (Foshan) technology Co., LTD. Foshan 528200 China

Abstract

AbstractDespite the fact that flexible temperature sensors, which can be mechanically deformed, are used for the fabrication of next‐generation smart electronics over the past few years, the improvement in their sensitivity and stability remains a major challenge. Along these lines, in this work, an all‐inorganic flexible temperature sensor consisting of MnCoNiO (MCNO) spinel structural ceramics film and a flexible 40 µm‐thick mica substrate is fabricated. By precisely controlling the production process, the pure spinel phase MCNO/mica films with low defect density can be obtained. In addition, the activation energy of the proposed flexible ceramic temperature sensor film remains stable in the natural bending state and at radii of curvature of 10, 15, and 20 mm, respectively, accordingly, B25/50 is relatively stable around the range of 3450–3550 K. Meanwhile, its sensitivity temperature coefficient of resistance value reaches −3.9% °C−1. More specifically, ΔB25/50 is less than 1.83%, 1.57%, and 1.32% after thermal shock, application of the bending cycle, and vibration, respectively. The superior performance of this all‐inorganic ceramic film is due to the excellent bonding between the film and the substrate. This work provides an alternative approach to exploit the development of the next‐generation high‐sensitivity flexible electronic devices.

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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