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H2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs

  • Published:2014-11-25 Issue:12 Volume:43 Page:1953-1970
  • ISSN:0098-9886
  • Container-title:International Journal of Circuit Theory and Applications
  • language:en
  • Short-container-title:Int. J. Circ. Theor. Appl.

Author:

Chen Hai-Bao1,Tan Sheldon X.-D.2,Shin David H.2,Huang Xin2,Wang Hai3,Shi Guoyong1

Affiliation:

1. Department of Micro/Nano-electronics; Shanghai Jiao Tong University; Shanghai China

2. Department of Electrical and Computer Engineering; University of California; Riverside, CA USA

3. School of Microelectronics & Solid-State Electronics; University of Electronic Science & Technology of China; Chengdu China

Funder

NSF

Semiconductor Research Corporation

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Science Applications,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Reliable 3D clock-tree synthesis considering nonlinear capacitive TSV model with electrical-thermal-mechanical coupling;Manoj;IEEE Transactions on Computer-Aid Design of Integrated Circuits and Systems,2013

2. Managing the impact of increasing microprocessor power consumption;Gunther;Intel Technology Journal,2001

3. Dynamic thermal management for high-performance microprocessors;Brooks;Proceedings of International Symposium on High-Performance Computer Architecture,2001

4. A general method for small-signal circuit analysis considering thermal effects;Conte;International Journal of Circuit Theory and Applications,1978

5. Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power;Yu;IEEE Transactions on Very Large Scale Integration Systems,2008

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