Enhancing thermal conductivity of epoxy composites via f‐BN@f‐MgO hybrid fillers assisted by hot pressing

Author:

Wu Xudong1,Yu Haojie12ORCID,Wang Li12ORCID,Meng Xingguang1,Huang Zhikun1,Liu Xiaowei1,Gong Xiaodan1,Liu Jinyi1

Affiliation:

1. State Key Laboratory of Chemical Engineering College of Chemical and Biological Engineering, Zhejiang University Hangzhou People's Republic of China

2. Zhejiang‐Russia Joint Laboratory of Photo‐Electron‐Megnetic Functional Materials College of Chemical and Biological Engineering, Zhejiang University Hangzhou People's Republic of China

Abstract

AbstractHigh thermal conductive polymeric composites are extremely desired for the thermal management of electronic devices due to the rapid development of the modern microelectronic industry. Herein, the functionalized boron nitride (BN) and magnesium oxide (MgO) hybrid fillers (f‐BN@f‐MgO) were synthesized and used to prepare the enhanced thermal conductive epoxy (EP) composites through the hot‐pressing method. The results demonstrated that the covalent binding of BN and MgO in the hybrid fillers reduced the interface thermal resistance effectively between fillers and matrix and the hot‐pressing induced force facilitated the construction of the continuous thermal conduction paths. Consequently, the as‐prepared epoxy composite at 40 wt% hybrid fillers loading had high thermal conductivity (TC) (1.97 W/[m·K]), outstanding insulating performance (6.9 × 1015 Ω cm) and excellent thermal stability. Furthermore, a probable thermal conduction mechanism was proposed to illustrate the high TC of the epoxy composite. Therefore, this study provides a new approach to preparing epoxy composites with outstanding performances.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

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