1. Wafer Bonding
2. Pseudo epi -cost reduction approach and a paradigm shift in substrate material;Aminzadeh;IEEE Trans. Semicond. Manuf.,2002
3. Integration of indium phosphide thin film structures on silicon substrates by direct wafer bonding;Arokiaraj;J. Phys.: Conf. Ser.,2006
4. Oxygen precipitation in silicon;Borghesi;J. Appl. Phys.,1995
5. Frontiers in silicon-on-insulator;Celler;J. Appl. Phys.,2003