High thermal conductivity EP adhesive based on the GO/EP interface optimized by TDI
Author:
Affiliation:
1. School of Materials Science and EngineeringHarbin University of Science and Technology Harbin China
2. Key Laboratory of Engineering Dielectrics and Its Application, Ministry of EducationHarbin University of Science and Technology Harbin China
Funder
Fundamental Research Foundation for University of Heilongjiang Province
Publisher
Wiley
Subject
Polymers and Plastics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.4865
Reference26 articles.
1. Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging
2. Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites
3. Nanopolydopamine coupled fluorescent nanozinc oxide reinforced epoxy nanocomposites
4. Experimental and theoretical studies on the adjustable thermal properties of epoxy composites with silver-plated short fiberglass
5. Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
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