Effects of deposition rate control process on the adhesion of evaporated aluminum films-Reference-Cited by-同舟云学术

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Effects of deposition rate control process on the adhesion of evaporated aluminum films

Published:1996 Issue:7 Volume:79 Page:76-85
ISSN:8756-663X
Container-title:Electronics and Communications in Japan (Part II: Electronics)
language:en
Short-container-title:Electron. Comm. Jpn. Pt. II

Author:

Kobayashi Fumitoshi,Nomura Akio,Kano Tetsuo

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy

Reference14 articles.

1. and . Adhesion of evaporated metal films on glass. Proc. Roy. Soc., London, Ser., pp. 516–531.

2. Measurements of the Adhesion of Evaporated Metal Films

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simple approach for improving gold deposition inside nanoporous alumina template on Si substrate;Applied Surface Science;2014-06

2. Vapour phase co-deposition of Al-Cu thin film alloys;physica status solidi (a);2013-05

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