High-density wiring technology in multiwire boards-Reference-Cited by-同舟云学术

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High-density wiring technology in multiwire boards

Published:1989 Issue:11 Volume:72 Page:17-29
ISSN:8756-663X
Container-title:Electronics and Communications in Japan (Part II: Electronics)
language:en
Short-container-title:Electron. Comm. Jpn. Pt. II

Author:

Fukutomi Naoki,Iwasaki Yorio,Kojima Fujio,Kamiyama Hiroharu,Asai Masahide,Kawada Nobuo

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy

Reference7 articles.

1. and . A new wiring board manufacturing process–Multiwire. Tech. Rep. Comp. and Mater. I.E.E., Japan, CPM74-61 (Nov. 1974).

2. et al. High-density Multiwire board. Tech. Rep. Comp. Mater., I.E.E., Japan, CPM76-51 (1976).

3. et al. Recent progress of Multiwire board. Tech. Proc. Hitachi Chemicals, pp. 27–32 (Oct. 1982).

4. Multiwire broad for VLSI packaging with improved electrical characteristics and high heat dissipation. Nikkei Electronics, pp. 137–158 (June 6, 1983).

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