55.2: Low Resistive Metallization and High Adhesion Layer of Ni Alloy in Stretchable Display Backplane
Author:
Affiliation:
1. Dept. of Materials Engineering Korea Aerospace University Goyang city 10504 Korea
2. Cuprum Materials inc. 76, Hanggongdaehak-ro, Goyang-si, 10540 KoreaGoyang city 10540 Korea
Publisher
Wiley
Subject
General Medicine
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.16020
Reference4 articles.
1. Patterning conductive PDMS nanocomposite in an elastomer using microcontact printing;Liu C. X.;Journal of Micromechanics and Microengineering,2009
2. Reliable fabrication method of transferable micron scale metal pattern for poly (dimethylsiloxane) metallization;Lim K. S.;Lab on a Chip,2006
3. Aligned carbon nanotube polymer hybrid architectures for diverse flexible electronic applications;Jung Y. J.;Nano letters,2006
4. Thickness dependent fatigue life at microcrack nucleation for metal thin films on flexible substrates;Sun X. J.;Journal of Physics D: Applied Physics,2008
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