High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification-Reference-Cited by-同舟云学术

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High‐thermal conductivities of epoxy composites via p‐phenylenediamine interfacial modification and process intensification

Published:2021-06-02 Issue:41 Volume:138 Page:51218
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Bao Di¹,Xu Fei²,Cui Yexiang²,Yuan Sicheng²,Zhang Xiguang²,Zhu Yanji¹³,Gao Yueyang²,Wang Huaiyuan¹²^ORCID

Affiliation:

1. College of Chemistry and Chemical Engineering Northeast Petroleum University Daqing China

2. School of Chemical Engineering and Technology and State Key Laboratory for Chemical Engineering Tianjin University Tianjin China

3. Tianjin Key Lab Composite & Functional Materials, School of Materials Science and Engineering Tianjin University Tianjin China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.51218

Reference55 articles.

1. Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material

2. Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework

3. High thermal conductivity of epoxy composites via micro-zone enhanced 3D interconnected nickel skeleton

4. Manipulating Orientation of Silicon Carbide Nanowire in Polymer Composites to Achieve High Thermal Conductivity

5. Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

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