Microstructural and chemical properties of Cu-In alloys formed using co-electrodeposition-Reference-Cited by-同舟云学术

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Microstructural and chemical properties of Cu-In alloys formed using co-electrodeposition

Published:2012-04-12 Issue:11-12 Volume:44 Page:1418-1422
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Moon Kyung-Won¹,Ashok Kumar A.²,Lee Young-Boo³,Park Yang-Kyu⁴,Choi Chel-Jong¹⁴

Affiliation:

1. Department of BIN Fusion Technology; Chonbuk National University; Jeonju 561-756 Korea

2. Department of Physics; Y. S. R. Engineering College of Yogi Vemana University; Proddatur 516 360 India

3. Jeonju Center, Korea Basic Science Institute; Jeonju 561-756 Korea

4. School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center; Chonbuk National University; Jeonju 561-756 Korea

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/sia.4960/fullpdf

Reference16 articles.

1. Fractal Structures of Zinc Metal Leaves Grown by Electrodeposition

2. Silver Dendrites from Galvanic Displacement on Commercial Aluminum Foil As an Effective SERS Substrate

3. Dendritic Nanostructures of Silver: Facile Synthesis, Structural Characterizations, and Sensing Applications

4. Ionic Liquid-Assisted Growth of Single-Crystalline Dendritic Gold Nanostructures with a Three-Fold Symmetry

5. Fractal Growth of Milk Fat Crystals Is Unaffected by Microstructural Confinement

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical Liquid‐Liquid‐Solid Growth of Ag‐In Crystals with Liquid Indium Alloy Electrodes;ChemElectroChem;2024-06-27

2. Electrodeposition-based fabrication of graphene/copper composites with excellent overall properties;Journal of Alloys and Compounds;2022-11

3. Surface Morphology and Crystal Orientation of Pyramidal Shaped Tin Deposited by Electroplating;Nanoscience and Nanotechnology Letters;2016-07-01

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