Study on highly thermostable low‐k polymer films based on fluorene‐containing polyetherimides-Reference-Cited by-同舟云学术

Study on highly thermostable low‐k polymer films based on fluorene‐containing polyetherimides

Published:2021-08-28 Issue:10 Volume:61 Page:2639-2652
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

Olariu Marius Andrei¹²^ORCID,Hamciuc Corneliu³,Asandulesa Mihai³,Hamciuc Elena³,Epure Elena‐Luiza⁴,Tsakiris Violeta⁵,Lisa Gabriela⁶

Affiliation:

1. Electrical Engineering Faculty, Department of Electrical Measurements and Materials “Gh. Asachi” Technical University Iasi Romania

2. R&D Department Prosupport Consulting SRL Iasi Romania

3. “Petru Poni” Institute of Macromolecular Chemistry Iasi Romania

4. Faculty of Chemical Engineering and Environmental Protection “Cristofor Simionescu”, Department of Natural and Synthetic Polymers “Gh. Asachi” Technical University of Iasi Iasi Romania

5. Department of Composite and Polymer Metallic Materials INCDIE ICPE‐CA Bucharest Romania

6. Faculty of Chemical Engineering and Environmental Protection “Cristofor Simionescu”, Department of Chemical Engineering “Gh. Asachi” Technical University of Iasi Iasi Romania

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.25792

Reference61 articles.

1. High-Temperature Polymers for Advanced Microelectronics

2. Low dielectric constant polymers for microelectronics

3. Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

4. Molecular Design of Free Volume as a Route to Low-κ Dielectric Materials

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