95‐3: Fabrication of Sub‐Micron Organic/Inorganic Hybrid Thin‐Film Encapsulation on Ultra‐High‐Resolution Microdisplays Using Inkjet Printing Process.

Author:

Kim Dasol12,Joo Chul Woong1,Shin Jin-Wook1,Cho Hyunsu1,Kang Chan-mo1,Choi Sukyung1,Ahn Dae Hyun1,Byun Chun won1,Cho Nam Sung1,Kim Kukjoo1,Baek In-Bok1,Suh Hyungwoo1,Woo Seung Wan12,Lee Jonghee2,Kwon Byoung-Hwa1

Affiliation:

1. Reality Device Research Division Electronics and Telecommunications Research Institute (ETRI) 218 Gajeong-ro, Youseong-gu Daejeon 34219 Republic of Korea

2. Department of Creative Convergence Engineering Hanbat National University 125 Dongseo-daero, Youseoung-gu Daejeon 34158 Republic of Korea

Abstract

In this study, we fabricated sub‐micron organic/inorganic hybrid TFE (Thin Film Encapsulation). We utilize an inkjet printing process to fabricate organic layer. It has excellent industrial applicability by using an industrial printhead with 1024 nozzles. The thickness of the organic layer is optimized through the DPI (Drops Per Inch) of inkjet printing and surface treatment of substrate. The sub‐micron organic/inorganic hybrid TFE was fabricated on a TEOLED (Top Emission Organic Light Emitting Diode), and the OLED (Organic Light Emitting Diode) with the fabricated TFE did not show degradation. Under constant temperature and humidity conditions 30°C, 90 % R.H. (Relative Humidity), the luminance of the OLED remained the same without any defects. The fabricated TFE for the production of OLEDoS has excellent encapsulation properties even at a thin thickness. Finally, we are investigating the optical properties of the ultra‐high‐resolution microdisplay panel applied with the sub‐micron organic/inorganic hybrid TFE.

Publisher

Wiley

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