Stress‐constrained multiscale topology optimization with connectable graded microstructures using the worst‐case analysis
Author:
Affiliation:
1. School of Mechanical Engineering and Automation Beihang University Beijing China
2. State Key Laboratory of Virtual Reality and Systems Beihang University Beijing China
Publisher
Wiley
Subject
Applied Mathematics,General Engineering,Numerical Analysis
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/nme.6920
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