Low Temperature Deposition of High‐Quality Silicon Oxynitride (SiON) for OLED Encapsulation via Conventional PECVD
Author:
Affiliation:
1. Peking University Shenzhen Graduate SchoolPeking University Shenzhen China
2. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Shenzhen China
Publisher
Wiley
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.13784
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