Accuracy and sensibility analysis of strain measurement based on microimages captured by smartphone with a microscope
Author:
Affiliation:
1. School of Civil Engineering Dalian University of Technology Dalian China
2. State Key Laboratory of Coastal and Offshore Engineering Dalian University of Technology Dalian China
Publisher
Wiley
Subject
Mechanics of Materials,Building and Construction,Civil and Structural Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/stc.2692
Reference34 articles.
1. Structural Health Monitoring in mainland China: Review and Future Trends
2. Structural Health Monitoring (SHM) of Civil Structures;Song G;Appl Sci,2017
3. Utilization of structural health monitoring in long-span bridges: Case studies
4. Smart wireless sensor technology for structural health monitoring of civil structures;Cho S;Steel Struct,2008
5. Monitoring of bolt looseness‐induced damage in steel truss arch structure using piezoceramic transducers;Jiang T;IEEE Sens J,2018
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