Functionalization of Copper Surfaces by Plasma Treatments to Improve Adhesion of Epoxy Resins-Reference-Cited by-同舟云学术

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Functionalization of Copper Surfaces by Plasma Treatments to Improve Adhesion of Epoxy Resins

Published:2009-05-26 Issue:S1 Volume:6 Page:S490-S495
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Processes Polym.

Author:

Borges Juliano Nestor,Belmonte Thierry,Guillot Jérôme,Duday David,Moreno-Couranjou Maryline,Choquet Patrick,Migeon Henri-Noël

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Reference8 articles.

1. Surface modification and characterization of photodefinable epoxy/copper systems

2. Y. Kusano T. L. Andersen B. F. Sørensen P. K. Michelsen 28th Risø International Symposium on Materials Science 2007 207

3. J. N. Borges T. Belmonte D. Duday P. Choquet H.-N. Migeon J. Petry 31st Annual Meeting of The Adhesion Society 2008 129

4. Modeling of nitrogen atom recombination on Pyrex: Influence of the vibrationally excited N2 molecules on the loss probability of N

5. Properties of amine-containing coatings prepared by plasma polymerization

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