The solid/porous compound wavy microchannel heat sinks with 45° secondary channel flow of thermo‐hydraulic performance

Abstract

AbstractNowadays, microchannel‐based cooling systems are one of the best heat exchangers to extract a huge amount of heat from miniature devices. In this present study, a 15‐μm thickness porous fin in solid/porous compound wavy (CWPF) with a 45° secondary channel (SC) heat sink has been investigated with a Reynolds number range of 50–300 and is compared with CWPF heat sinks. Fluid flow through porous fins is solved by Darcy–Forchheimer flow models, and the thermo‐hydraulic performance of microchannel heat sinks is solved a using finite volume approach. The walls and fins are made of copper, and the operating fluid is pure water. The significant impact on heat transfer and fluid flow characteristics has been discussed. The effect of SC/route width variations is examined. It is observed that as the width ratio (α) increases, both the Nusselt number and pressure drop significantly increase up to the width ratio of 3 and then decrease as it increases. This is due to the increased effective fluid mixing by the dean vortices through secondary flow at the crest and trough as well as permeation effect in the porous zone. The highest performance factor of 68.95% is measured for CWPF (45° SC) with a width ratio of 3 when compared with CWPF heat sinks. Hence, CWPF with SC flow has an ability to improve the cooling rate of micro‐electronics components.