1. An investigation of the conditions of spontaneous growth of filiform crystals on electrolytic coatings;Glazunova;Zh Prikl Khim,1963
2. Repressing the growth of tin whiskers;Arnold;Plating,1966
3. Yanada I 1998
4. Lead-free solder plating technology for outer leads of semiconductor devices;Sakaguchi;Electron Packag Technol,1999
5. Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly;Tanaka;J Electron Mater,1999