Reconstitution of full-thickness skin by microcolumn grafting
Author:
Affiliation:
1. Wellman Center for Photomedicine, Massachusetts General Hospital; Boston MA USA
2. Department of Dermatology; Harvard Medical School; Boston MA USA
Publisher
Wiley
Subject
Biomedical Engineering,Biomaterials,Medicine (miscellaneous)
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/term.2174/fullpdf
Reference51 articles.
1. Laser treatment of traumatic scars with an emphasis on ablative fractional laser resurfacing: consensus report;Anderson;JAMA Dermatol,2014
2. Induction of de novo hair regeneration in scars after fractionated carbon dioxide laser therapy in three patients;Beachkofsky;Dermatol Surg,2011
3. Is there an easier way to autograft skin in chronic leg ulcers? 'Minced micrografts', a new technique;Boggio;J Eur Acad Dermatol Venereol,2008
4. Tissue engineering of skin: human tonsil-derived mesenchymal cells can function as dermal fibroblasts;Bottcher-Haberzeth;Pediatr Surg Int,2014
5. Skin replacement in burn wounds;Brusselaers;J Trauma,2010
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Structural and molecular characteristics of weight‐bearing volar skin can be reconstituted by micro skin tissue column grafting;The FASEB Journal;2024-08-06
2. Characterization of heterogeneous skin constructs for full thickness skin regeneration in murine wound models;Tissue and Cell;2024-06
3. Aerospace Medicine Clinic;Aerospace Medicine and Human Performance;2023-12
4. Microcoring;Advances in Cosmetic Surgery;2023-11
5. Full‐thickness skin columns: A method to reduce healing time and donor site morbidity in deep partial‐thickness burns;Wound Repair and Regeneration;2023-08-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3