Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC @SiO 2 whiskers-Reference-Cited by-同舟云学术

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Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC @SiO 2 whiskers

Published:2020-02-28 Issue:5 Volume:60 Page:1044-1053
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

Yang Yang¹²^ORCID,Gao Jiming²,Lei Ting¹,Yang Jun²,Wang Jin²,Liu Jie²

Affiliation:

1. State Key Laboratory of Powder MetallurgyCentral South University Changsha China

2. Zhuzhou Times New Material Technology Co., Ltd Zhuzhou China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.25360

Reference41 articles.

1. Highly anisotropic thermally conductive polyimide composites via the alignment of boron nitride platelets

2. Thermal conductivity of polyimide/boron nitride nanocomposite films

3. Enhanced thermal conductivities and decreased thermal resistances of functionalized boron nitride/polyimide composites

4. Synergistic effect of boron nitride flakes and tetrapod-shaped ZnO whiskers on the thermal conductivity of electrically insulating phenol formaldehyde composites

5. Surface modification of BN/Fe3O4 hybrid particle to enhance interfacial affinity for high thermal conductive material

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1. Investigation into the thermal noise propagation mechanism within composite materials for gravitational wave detection systems;International Journal of Heat and Mass Transfer;2024-10

2. Excellent thermal conductivity and electrical insulation in polyimide/graphene oxide/carbon nanotubes composites;Polymer Composites;2024-06-14

3. The polymer-based thermal interface materials with improved thermal conductivity, compression resilience, and electromagnetic interference shielding performance by introducing uniformly melamine foam;Advanced Composites and Hybrid Materials;2023-07-13

4. Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber;Polymer Engineering & Science;2023-03-22

5. Mechanism Study for Pressure Influence on Thermal Conductivity of Polyimide: A Molecular Dynamics Study;2023

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