Affiliation:
1. State Key Lab of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering Shanghai Jiao Tong University Shanghai 200240 China
2. State Key Laboratory of Optical Fiber and Cable Manufacture Technology Yangtze Optical Fiber and Cable Joint Stock Limited Company (YOFC) Wuhan 430073 China
3. Nokia Bell Labs 600 Mountain Ave. New Providence New Jersey 07974 USA
Abstract
AbstractOptical interconnects have emerged as promising solutions for assisting electrical interconnects in short‐reach scenarios, where high bandwidth density and energy efficiency are of particular importance. Mode‐division multiplexing (MDM), capable of enhancing the bandwidth density and energy efficiency of optical systems, has drawn tremendous interest. However, the chip‐to‐chip MDM optical interconnects are impeded by the multimode chip‐fiber interfaces, where the transverse modes on the MDM chip mismatch with the linear polarization modes in the circular core few‐mode fiber (CCF). Moreover, the high differential group delays (DGDs) of a conventional CCF make the digital signal processing (DSP) computation complex thus consuming high power. To overcome these bottlenecks, a new multimode coupling solution based on a rectangular core few‐mode fiber with ultra‐low DGDs and an integrated multimode coupler is proposed. Based on this coupling scheme, a chip‐to‐chip MDM transmission experiment is performed on the TE00, TM00, TE10, and TM10 modes, and the highest bandwidth density of 19.4 Tb s mm −1 is realized at the chip facet. The DSP power consumption is ≈6% of a conventional CCF‐based system. It is believed that this work will pave the way for ultra‐compact, high density, low cost, and low computation‐complexity optical interconnects, such as data centers, cloud computing, and telecommunications.
Funder
Key Technologies Research and Development Program
Subject
Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials