Multimode Waveguide Bends in Lithium Niobate on Insulator

Author:

Ma Mingyang1,Yuan Mingrui2,Zhou Xudong2,Xiao Huifu2,Cao Pengfei1,Cheng Lin1,Nguyen Thach Giang3,Boes Andreas345,Ren Guanghui3ORCID,Su Yikai6,Mitchell Arnan3,Tian Yonghui2ORCID

Affiliation:

1. Institute of Optoelectronics & Electromagnetic Information School of Information Science and Engineering Lanzhou University Lanzhou Gansu 730000 China

2. School of Physical Science and Technology Lanzhou University Lanzhou Gansu 730000 China

3. Integrated Photonics and Applications Centre (InPAC) School of Engineering RMIT University Melbourne VIC 3001 Australia

4. School of Electrical and Electronic Engineering The University of Adelaide Adelaide SA 5005 Australia

5. Institute for Photonics Advanced Sensing The University of Adelaide Adelaide SA 5005 Australia

6. The State Key Laboratory of Advanced Optical Communication Systems and Networks Department of Electronic Engineering Shanghai Jiao Tong University Shanghai 200240 China

Abstract

AbstractLithium niobate on insulator (LNOI) is a promising platform for realizing high‐performance photonic integrated circuits (PICs) for communication applications due to LN's excellent electro‐optic properties. Multimode photonic devices are attractive as they can improve the communication capacity of PICs by multiplexing orthogonal modes. For connecting multimode photonic components on the same chip, multimode waveguide bends are indispensable. In this contribution, multimode waveguide bends are proposed, simulated, and experimentally demonstrated with double air grooves to ensure low crosstalk for three different transverse electric (TE) modes by improving the mode overlap at the interface between the straight and bent waveguide when the waveguide is bent. This enables demonstration of S‐shaped waveguide bends (two 90o bent waveguides) with insertion losses below 1.42, 1.12, and 2.5 dB in the wavelength range of 1525–1575 nm for the transmitted TE0, TE1, and TE2 modes, respectively. The mode crosstalk is lower than −12.2 dB for all three modes. The demonstrated device provides a compact solution for multimode waveguide bends in the LNOI platform, paving the way for high‐speed, high‐data‐capacity PICs for on‐chip communication systems.

Publisher

Wiley

Subject

Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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