Waveguide‐Based On‐Chip Photothermal Spectroscopy for Gas Sensing

Author:

Zheng Kaiyuan1,Pi Mingquan2,Huang Yijun2,Peng Zihang2,Zhao Huan2,Song Fang2,Bao Haihong13,Jiang Shoulin3,Ho Hoi Lut13,Zheng Chuantao2ORCID,Jin Wei13,Zhang Yu2,Wang Yiding2

Affiliation:

1. Department of Electrical and Electronic Engineering and Photonics Research Institute The Hong Kong Polytechnic University Hong Kong 518060 China

2. State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun 130012 China

3. Photonics Research Center The Hong Kong Polytechnic University Shenzhen Research Institute Shenzhen 518057 China

Abstract

AbstractOn‐chip waveguide spectroscopic sensors have attracted considerable attention due to its potential for large‐scale integration. However, existing waveguide gas sensors based on direct absorption spectroscopy (DAS) suffer from limited sensitivity and measurement range. Here waveguide‐based on‐chip photothermal spectroscopy (PTS) is demonstrated for gas detection with high sensitivity and large dynamic range. On‐chip photothermal field due to non‐radiation relaxation of gas molecules and the resulted photothermal phase modulation are analyzed. By selecting chalcogenide glass (ChG) as the core‐layer material and fabricating thermally‐isolated ChG‐on‐SU8 waveguide for thermal field accumulation, a twofold increase in photothermal phase modulation is achieved as compared to ChG‐on‐SiO2 waveguides. Different from the major concern of multi‐path etalon noise in DAS, piezoelectric transducer noise in the interferometer is identified as the main source in this PTS. For a fair comparison, acetylene (C2H2) detection experiments are conducted using PTS and DAS with a 2 cm‐long ChG‐on‐SU8 waveguide. A remarkable sensitivity of 4 parts‐per‐million (ppm) is achieved, which is 16 times better than that of DAS. The dynamic range extends over five orders of magnitude for PTS, ≈3 orders of magnitude larger than that of DAS. Such high performance opens the possibility of fully‐integrated chip‐level sensors for low‐power, light‐weight applications.

Funder

Hong Kong Polytechnic University

National Natural Science Foundation of China

Publisher

Wiley

Subject

Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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