Affiliation:
1. Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information Huazhong University of Science and Technology Wuhan Hubei 430074 China
2. Optics Valley Laboratory Wuhan Hubei 430074 China
3. State Key Laboratory for Modern Optical Instrumentation Center for Optical & Electromagnetic Research College of Optical Science and Engineering International Research Center for Advanced Photonics Zhejiang University Zijingang Campus Hangzhou 310058 China
Abstract
AbstractMultidimensional multiplexing technologies have been proven to be a promising scheme to meet the demands of high‐capacity optical interconnects and optical processing networks. However, challenges remain to realize multidimensional hybrid multiplexing data transmission and signal processing between few‐mode fiber transmission links and on‐chip optical processing networks, since the optical coupling between fiber and chip is almost exclusively in the single‐mode regime. Here, a multidimensional fiber‐to‐chip optical processing system is proposed and demonstrated for hybrid wavelength‐, mode‐, and polarization‐division multiplexing signals, where multidimensional coupling between few‐mode fiber transmission link and on‐chip multi‐mode processing network is realized by using a 3D photonic integrated (de)multiplexers on a glass chip as well as 2D photonic integrated (de)multiplexers on a silicon chip, and the on‐chip multidimensional optical processing network composed by parallel cascaded micro‐ring resonator array performs a function of reconfigurable optical add/drop multiplexer. By operating wavelength‐division multiplexing in conjunction with mode‐division multiplexing and polarization‐division multiplexing, the communication bandwidth of fiber‐to‐chip optical processing systems can be further scaled.
Funder
National Natural Science Foundation of China
National Key Research and Development Program of China