3D Multilevel Modeling of Surface Roughness Influences on Hole Expansion Ratios
Author:
Affiliation:
1. Steel Institute RWTH Aachen University Intzestraße 1 52072 Aachen Germany
2. Advanced Manufacturing and Materials Department of Mechanical Engineering Aalto University Otakaari 4 02150 Espoo Finland
Publisher
Wiley
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/srin.202100449
Reference35 articles.
1. Evaluation of the cold formability of high-strength low-alloy steel plates with the modified Bai–Wierzbicki damage model
2. Design of damage tolerance in high-strength steels
3. A hybrid approach for modelling of plasticity and failure behaviour of advanced high-strength steel sheets
4. Extension of the modified Bai-Wierzbicki model for predicting ductile fracture under complex loading conditions
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