Curing behavior, mechanical and thermal properties of epoxy‐CeO 2 nanocomposites-Reference-Cited by-同舟云学术

Curing behavior, mechanical and thermal properties of epoxy‐CeO 2 nanocomposites

Published:2021-08-25 Issue:4 Volume:139 Page:51529
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Yuan Zhi‐gang¹,Al Hassan Mohamadou¹,Wang Zhi‐cheng¹,Wang Jun‐yi¹,Wang Jun¹,Derradji Mehdi²,Liu Wen‐bin¹^ORCID

Affiliation:

1. Key Laboratory of Superlight Material and Surface Technology of Ministry of Education, College of Materials Science and Chemical Engineering Harbin Engineering University Harbin China

2. UER Procédés énergétiques Ecole Militaire Polytechnique Algiers Algeria

Funder

Fundamental Research Funds for the Central Universities

Heilongjiang Provincial Science and Technology Department

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.51529

Reference47 articles.

1. Synthesis and application of low-cost layered double hydroxides intercalated by gluconic acid anion for flame retardancy and tensile strength conservation of high filling epoxy resin

2. Effect of epoxy resin on the thermal behaviors and viscoelastic properties of poly(phenylene sulfide)

3. A room temperature cured low dielectric hyperbranched epoxy adhesive with high mechanical strength

4. A comparative study of epoxy resin cured with a linear diamine and a branched polyamine

5. An overview of multifunctional epoxy nanocomposites

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