Direct Patterning of Copper on Polyimide by Site-Selective Surface Modification via a Screen-Printing Process
Author:
Publisher
Wiley
Subject
Physical and Theoretical Chemistry,Atomic and Molecular Physics, and Optics
Reference20 articles.
1. Surface Modification Studies of Polyimide Films Using Rutherford Backscattering and Forward Recoil Spectrometry
2. High Glass Transitions of New Polyamides, Polyimides, and Poly(amide−imide)s Containing a Triphenylamine Group: Synthesis and Characterization
3. Current Trends in Patterning with Copper
4. Polymer-Initiated Photogeneration of Silver Nanoparticles in SPEEK/PVA Films: Direct Metal Photopatterning
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3. Polyimide Metallization Using Nickel Nano-Film as both Catalyst and Barrier Layer of Copper Electroless Deposition;Journal of The Electrochemical Society;2019
4. Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition;Journal of The Electrochemical Society;2017
5. Fabrication of a wettability-gradient surface on copper by screen-printing techniques;Journal of Micromechanics and Microengineering;2015-07-14
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