Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system-Reference-Cited by-同舟云学术

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Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system

Published:2002 Issue:12 Volume:51 Page:1422-1427
ISSN:0959-8103
Container-title:Polymer International
language:en
Short-container-title:Polym. Int.

Author:

Gao Jungang,Zhao Hongchi,Li Yanfang

Publisher

Wiley

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference26 articles.

1. and Jpn Kokai Tokkyo Koho, JP 11 116 662 (1999).

2. Jpn Kokai Tokkyo Koho, JP 07 292 072 (1995).

3. and Czech Rep, CZ 280 402 (1996).

4. Interfacial residual thermal strain

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