Curing and electrical conductivity of conductive glues for die attach in microelectronics-Reference-Cited by-同舟云学术

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Curing and electrical conductivity of conductive glues for die attach in microelectronics

Published:2006 Issue:4 Volume:38 Page:429-432
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Scandurra A.,Cavallaro A.,Pignataro S.,Tiziani R.,Gobbato L.,Cognetti C.

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference7 articles.

1. , , , . More Insight into the Soft Solder Die Attach, On 11th European Microelectronics Conference Proceedings, Venice, Italy, 1997; 308.

2. IPC/JEDEC Test Method J-STD-020 C.

3. , , , , . Lead Free Soft Solder Die Attach Process for Power Semiconductor Packaging, Proceedings of Semicon China, Shanghai, China, March, 2002.

4. ESCA applied to polymers. XXI. Investigation of sample-charging phenomena

5. Recent developments in high energy and spatial resolution analysis of polymers by XPS

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