Three-dimensional simulation of microchip encapsulation process
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference21 articles.
1. Lead Reduction Among Combinatorial Logic Circuits
2. Reliability assessment of fielded plastic and hermetically packaged microelectronics
3. An Overview of Integrated Circuit Device Encapsulants
4. C-Mold, Advanced CAE Technology, Inc., Ithaca, NY, 14850.
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