Incorporation of mushroom powder into bread dough-effects on dough rheology and bread properties
Author:
Affiliation:
1. Department of Wine, Food and Molecular Biosciences; Lincoln University; Lincoln Christchurch New Zealand
2. Riddet Institute; Palmerston North; New Zealand
Publisher
Wiley
Subject
Organic Chemistry,Food Science
Reference48 articles.
1. Quality characteristics of bread made from wheat and fluted pumpkin seed flour;Agu;Nigerian Food Journal,2010
2. Rheological properties of water insoluble date fiber incorporated wheat flour dough;Ahmed;LWT - Food Science and Technology,2013
3. Effect of the addition of alhydwan seed flour on the dough rheology, bread quality, texture profile and microstructure of wheat bread;Ammar;Journal of Texture Studies,2016
4. Study on nutritional evaluation and composition of oyster mushrooms (Pleurotus florida);Bora;Food Science Research Journal,2014
Cited by 37 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Nutritional enhancement, microstructural modifications, and sensory evaluation of mushroom‐enriched multigrain bread;International Journal of Food Science & Technology;2024-09-10
2. Lactic acid bacteria‐fermented Chlamydomonas reinhardtii as an innovative ingredient to produce microalgae‐enriched steamed bread;Cereal Chemistry;2024-09-05
3. Impact of Incorporating Dried Chaga Mushroom (Inonotus obliquus) into Gluten-Free Bread on Its Antioxidant and Sensory Characteristics;Molecules;2024-08-10
4. Property and quality of japonica rice cake prepared with Polygonatum cyrtonema powder;Food Chemistry: X;2024-06
5. Pre- and Postharvest Strategies for Pleurotus ostreatus Mushroom in a Circular Economy Approach;Foods;2024-05-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3