1. Effectiveness of thermal redistribution layer in cooling of
3D ICs
2. Study on TSV‐Cu protrusion under different annealing conditions and optimization;Deng Q;Int Conf El Packag Tech,2016
3. Improving the barrier ability of Ti in cu through‐silicon vias through vacuum annealing;Mariappan M;Jpn J Appl Phys,2017
4. Mechanical reliability testing of air‐gap through‐silicon vias;Huang C;IEEE T Comp Pack Man,2016
5. PavlidisF SavidisI FriedmanG.Three‐dimensional integrated circuit design. The Netherlands2017.