Affiliation:
1. BOE Technology Group Co., LTD. Beijing China
Abstract
A novel PI substrate structure was developed for FDC to improve the transmittance, that is, the first layer of double‐layer PI is patterned. The crystalline state of polysilicon and evaporation shadow of this structure have proved that the structure is feasible. This structure can avoid the warping of single‐layer PI, and achieve the same transmittance as single‐layer PI.
Cited by
2 articles.
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