Interconnection loss from substrate effects on LNA performance and design accuracy-Reference-Cited by-同舟云学术

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Interconnection loss from substrate effects on LNA performance and design accuracy

Published:2008-11-13 Issue:1 Volume:51 Page:144-146
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw. Opt. Technol. Lett.

Author:

Tseng S.-C.,Meng C. C.,Liao H.-Y.,Lin Y.-C.,Teng Y.-H.

Funder

National Science Council of Taiwan, Republic of China

Ministry of Economic Affairs of Taiwan

MoE ATU Program

Taiwan Semiconductor Manufacturing Company Ltd.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mop.23968/fullpdf

Reference7 articles.

1. Small-signal and high-frequency noise modeling of SiGe HBTs;Basaran;IEEE Trans Microwave Theory Tech,2005

2. Silicon substrate coupling noise modeling;Jin;analysis, and experimental verification for mixed signal integrated circuit design, IEEE MTT-S Int Microwave Symp Dig, Phoenix,,2001

3. Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate;Zheng;IEEE Trans Microwave Theory Tech,2001

4. T. Kanamoto T. Ikeda A. Tsuchiya H. Onodera M. Hashimoto Si-substrate modeling toward substrate-aware interconnect resistance and inductance extraction in SoC design 2006 227 230

5. When are substrate effects important for on-chip interconnects?;Ktata;Electr Perform Electron,2003

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