X-ray fluorescence analysis of Co, Ni, Pd, Ag, and Au in the scrapped printed-circuit-board ash
Author:
Affiliation:
1. Department of Applied Chemistry; Meiji University; Kawasaki; 214-8571; Japan
2. Application Laboratory; Rigaku Corporation; Tokyo; 196-8666; Japan
Publisher
Wiley
Subject
Spectroscopy
Reference22 articles.
1. Aluminum recovery from electronic scrap by High-Force® eddy-current separators
2. Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap
3. Recycle Technology for Recovering Resources and Products from Waste Printed Circuit Boards
4. Materials Separation from Pulverized Waste Printed Circuit Boards
5. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill
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2. Characterization of a printed-circuit board by X-ray fluorescence and X-ray diffraction analyses for metal recovery;Spectrochimica Acta Part B: Atomic Spectroscopy;2023-12
3. Solid Sample Preparations and Applications for X‐Ray Fluorescence Analysis;Encyclopedia of Analytical Chemistry;2023-06-30
4. A Novel Calibration Method for Pxrf Analysis of Printed Circuit Boards;2023
5. A Comparison of Methods for the Characterisation of Waste-Printed Circuit Boards;Metals;2021-11-30
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