Affiliation:
1. State Key Laboratory of Silicate Materials for Architectures School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China
2. Key Laboratory for Liquid‐Solid Structural Evolution and Processing of Materials (Ministry of Education) Shandong University 17923 Jingshi Road Jinan 250061 China
3. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Center of Smart Materials and Devices Wuhan University of Technology Wuhan 430070 China
4. State Key Lab of New Ceramics and Fine Processing School of Materials Science and Engineering Tsinghua University Beijing 100084 China
Abstract
AbstractPrinting technology enables the integration of chemically exfoliated perovskite nanosheets into high‐performance microcapacitors. Theoretically, the capacitance value can be further enhanced by designing and constructing multilayer structures without increasing the device size. Yet, issues such as interlayer penetration in multilayer heterojunctions constructed using inkjet printing technology further limit the realization of this potential. Herein, a series of multilayer configurations, including Ag/(Ca2NaNb4O13/Ag)n and graphene/(Ca2NaNb4O13/graphene)n (n = 1–3), are successfully inkjet‐printed onto diverse rigid and flexible substrates through optimized ink formulations, inkjet printing parameters, thermal treatment conditions, and rational multilayer structural design using high‐k perovskite nanosheets, graphene nanosheets and silver. The dielectric performance is optimized by fine‐tuning the number of dielectric layers and modifying the electrode/dielectric interface. As a result, the graphene/(Ca2NaNb4O13/graphene)3 multilayer ceramic capacitors exhibit a remarkable capacitance density of 346 ± 12 nF cm−2 and a high dielectric constant of 193 ± 18. Additionally, these devices demonstrate moderate insulation properties, flexibility, thermal stability, and chemical sensitivity. This work shed light on the potential of multilayer structural design in additive manufacturing of high‐performance 2D material‐based ceramic capacitors.
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities