Design for Thermal Stresses-Reference-Cited by-同舟云学术

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Design for Thermal Stresses

Published:2011-09-21 Issue: Volume: Page:
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Author:

Barron Randall F.,Barron Brian R.

Publisher

John Wiley & Sons, Inc.

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Surge Current Failure and Thermal Analysis of 4H-SiC Schottky Barrier Diode;IEEE Transactions on Electron Devices;2024-06

2. The Forefronts and Issues of the Assessment of Strength of Materials at High Temperature;Journal of the Society of Materials Science, Japan;2024-02-15

3. Residual Stress;Quenchants and Quenching Technology;2024-02-01

4. Residual Stress;Quenchants and Quenching Technology;2024-02-01

5. Stability Analysis of an Axially Moving Viscoelastic Beam Under Transverse Magnetic Fields and Thermal Loads;2024

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