Enhancement of adhesion between copper foil and polyimide film containing thermally decomposable polystyrene particles
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.36615/fullpdf
Reference17 articles.
1. Polyimide modified with metal coupling agent for adhesion application
2. Organic/Inorganic Hybrid Network Materials by the Sol−Gel Approach
3. High temperature lifetime of polyimide/poly(silsesquioxane)-like hybrid films
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