Microstructural Characteristics of ECR Plasma Etched and Heat Treated Commercial Copper Foil

Author:

Karmakar Samit1,Kundu Soumik Kumar1,Bandyopadhyay Sujit Kumar1,Taki Gouranga Sundar1

Affiliation:

1. Department of Electronics and Communication Engineering Institute of Engineering and Management Kolkata 700091 India

Abstract

AbstractThe structural quality of the catalytic transition metal substrate plays a critical role in pristine graphene synthesis by chemical vapor deposition. In this work, the microstructural parameters of commercial copper foils are investigated in lieu of conventional laboratory grade crystalline copper foils. Initially, the commercial copper foils are simultaneously plasma etched and heat treated for a period of 30, 45 min, and 1 h respectively at two elevated temperature levels of 823 and 923 K under the exposure of hydrogen plasma. The experiments are carried out in a 2.45 GHz Electron Cyclotron Resonance (ECR) Plasma Enhanced Chemical Vapor Deposition (PE‐CVD) reactor, at an operating pressure of 5 × 10−2 mbar. X‐ray diffraction (XRD) results are plotted and analyzed by Williamson–Hall (W–H) method to determine microstructural parameters, e.g., micro‐strain, stress, average domain size, and energy density associated to the processed copper foils.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,Condensed Matter Physics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. ECR plasma-assisted single-step synthesis of hydrogenated graphene;2023 7th International Conference on Electronics, Materials Engineering & Nano-Technology (IEMENTech);2023-12-18

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