On the Investigation of the Thermal Degradation of Waste Printed Circuit Boards for Recycling Applications-Reference-Cited by-同舟云学术

On the Investigation of the Thermal Degradation of Waste Printed Circuit Boards for Recycling Applications

Published:2021-05-06 Issue: Volume: Page:2100054
ISSN:2366-7486
Container-title:Advanced Sustainable Systems
language:en
Short-container-title:Advanced Sustainable Systems

Author:

Khalil Mohamed¹²^ORCID,Chaouki Jamal¹²^ORCID,Harvey Jean‐Philippe³^ORCID

Affiliation:

1. Process Engineering Advanced Research Lab (PEARL) Department of Chemical Engineering Polytechnique Montréal University of Montreal Campus 2500 chemin de Polytechnique Montreal Quebec H3T 1J4 Canada

2. Édouard‐Montpetit University of Montréal Campus 2500 chemin de Polytechnique Montreal Quebec H3T 1J4 Canada

3. Centre for Research in Computational Thermochemistry (CRCT) Department of Chemical Engineering Polytechnique Montréal University of Montreal Campus 2500 chemin de Polytechnique Montreal Quebec H3T 1J4 Canada

Publisher

Wiley

Subject

General Environmental Science,Renewable Energy, Sustainability and the Environment

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adsu.202100054

Reference53 articles.

1. Electronic Waste and Existing Processing Routes: A Canadian Perspective

2. Enhanced extraction of copper from electronic waste via induced morphological changes using supercritical CO2

3. Recent Technologies in Electronic-Waste Management

4. Risk Assessment of E-Waste Recycling with a Focus on ISO 9000 Standard

5. Experimental investigation of bituminous pavement (VG30) using E-waste plastics for better strength and sustainable environment

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