On wafer thermal characterization of miniature gallium arsenide microcoolers with thermal loading from DC probes

Author:

Glover J.1,Khalid A.2,Cumming D. R. S.2,Bajo M. Montes3,Kuball M.3,Stephen A.4,Dunn G. M.4,Oxley C. H.1

Affiliation:

1. Department of Electronic Engineering, Faculty of Technology; De Montfort University; Leicester LE1 9BH United Kingdom

2. School of Engineering, University of Glasgow; Glasgow G12 8LT United Kingdom

3. Center for Device Thermography and Reliability, H. H. Wills Physics Laboratory; University of Bristol; Tyndall Avenue BS8 1TL United Kingdom

4. School of Engineering and Physical Sciences, University of Aberdeen; Aberdeen AB24 SFX United Kingdom

Funder

ENGINEERING PHYSICAL SCIENCE RESEARCH COUNCIL

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. AlGaN/GaN HFET reliability;Trew;IEEE Microwave Mag,2009

2. Superlattice microrefrigerators fusion bonded with optoelectronic devices;Zhang;IEEE Trans Compon Packag Technol,2005

3. Probe propels IR thermal microscopy to a new level;Oxley;Compd Semiconduct,2011

4. Enhanced hot spot cooling using bonded superlattice microcoolers with a trench structure;Zhang;IEEE Trans Compon Packag Technol,2008

5. Thermoelectric effects in submicron heterostructure barriers;Shakouri;Microscale Thermophys Eng,1998

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1. Flexible Thermoelectric Materials and Devices;Flexible Energy Conversion and Storage Devices;2018-07-06

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