Fabrication, characterization, and thermoelectric properties of soft polyurethane foam loaded with semiconducting poly(3‐hexylthiophene) nanofibers-Reference-Cited by-同舟云学术

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Fabrication, characterization, and thermoelectric properties of soft polyurethane foam loaded with semiconducting poly(3‐hexylthiophene) nanofibers

Published:2022-03-18 Issue:23 Volume:139 Page:52354
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J of Applied Polymer Sci

Author:

Mano Genki¹,Murasawa Yoshihiro¹,Shimamura Keisuke¹,Iso Ayaka¹,Kanehashi Shinji¹,Shimomura Takeshi¹^ORCID

Affiliation:

1. Graduate School of Engineering Tokyo University of Agriculture and Technology Tokyo Japan

Funder

International Polyurethane Technology Foundation

Japan Society for the Promotion of Science

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.52354

Reference35 articles.

1. Polyurethane Foams: Past, Present, and Future

2. Nanoclay‐Modified Rigid Polyurethane Foam

3. Nanodispersions of carbon nanofiber for polyurethane foaming

4. The influence of carbon fillers on the thermal properties of polyurethane foam

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent progress of poly(3-hexylthiophene)-based materials for thermoelectric applications;Materials Chemistry Frontiers;2024

2. Carbon Nanotube–Polyurethane Composite Sheets for Flexible Thermoelectric Materials;ACS Applied Nano Materials;2023-09-19

3. Compressible sponge electrodes by oxidative molecular layer deposition (oMLD) of polyethylenedioxythiophene (PEDOT) onto open-cell polyurethane sponges;Nanotechnology;2023-09-01

4. Electrospun Poly(vinyl alcohol)-Based Conductive Semi-interpenetrating Polymer Network Fibrous Hydrogel: A Toolbox for Optimal Cross-Linking;ACS Materials Au;2023-06-08

5. The influence of a pulsed-DC field on the growth of the Fe2B layer and the electrical behavior of the boriding media;Vacuum;2023-04

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