Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent
Author:
Affiliation:
1. Department of Polymer Processing Iran Polymer and Petrochemical Institute (IPPI) Tehran Iran
2. Department of Reactive processing Leibniz Institute of Polymer Research Dresden Dresden Germany
Publisher
Wiley
Subject
Polymers and Plastics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.5174
Reference49 articles.
1. Curing behavior and properties of high biosourced epoxy resin blends based on a triepoxy monomer and a tricarboxylic acid hardener from 10-undecenoic acid
2. Phosphorus- and silicon-containing amino curing agent for epoxy resin
3. Thermal Stability and Flame Retardancy Properties of Epoxy Resin Modified with Functionalized Graphene Oxide Containing Phosphorus and Silicon Elements
4. Evaluating a four-directional benzene-centered aliphatic polyamine curing agent for epoxy resins
5. Curing of epoxidized soybean oil with crystalline oligomeric poly(butylene succinate) towards high performance and sustainable epoxy resins
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