Research on contact difference plane layering and corrosion zoning of sealed relay contacts

Author:

Li Wenhua12,Lu Wenjiang1,Li Shuang1,Zheng Hang1,Jiao Zhipeng1

Affiliation:

1. State Key Laboratory of Reliability and Intelligence of Electrical EquipmentHebei University of Technology, No. 8, Guang Rong Street, Hong Qiao District Tianjin China

2. Key Laboratory of Electromagnetic Field and Electrical Apparatus Reliability of Hebei ProvinceHebei University of Technology, No. 8, Guang Rong Street, Hong Qiao District Tianjin China

Funder

Natural Science Foundation of Hebei Province

Publisher

Wiley

Subject

Electrical and Electronic Engineering

Reference18 articles.

1. MakotoH SeikaT. Influences of external magnetic field application and increased contact opening speeds on break arc duration characteristics of AgSnO2contacts in DC inductive load conditions.2017 IEEE Holm Conference on Electrical Contacts 2017;200–204.

2. A review of micro-contact physics for microelectromechanical systems (MEMS) metal contact switches

3. Failure analysis of contact‐type relays;Liu G;Journal of Electrical Engineering,2011

4. Failure analysis of electrical contacts for electromagnetic relay with switched type contacts;Ren W;Electrical Engineering Materials,2011

5. AzumaK HatakeyamaT NakagawaS. Measurement of surface roughness dependence of thermal contact resistance under low pressure condition.Electronic Packaging and iMAPS All Asia Conference (ICEP‐IACC) 2015 International Conference on. IEEE 2015;381–384.

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3. Fault Diagnosis and Isolation Prediction for Redundant Relays Based on Discrepancy Analysis;2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE);2023-02-25

4. Investigation of Relay Electrical Contact Failure Using SEM and Surface Composition Extraction with EDS and XRD;Iranian Journal of Science and Technology, Transactions of Electrical Engineering;2023-01-03

5. Contact Spots Analysis of Sealed Relay Contact Pair Based on Contact Difference‐Plane;IEEJ Transactions on Electrical and Electronic Engineering;2021-02-11

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