Line Tension of Grain Boundary Triple Junctions in the Copper Tricrystals

Author:

Zhao Bingbing,Shvindlerman Lasar,Gottstein Günter

Publisher

John Wiley & Sons, Inc.

Reference15 articles.

1. Influence of triple junctions on grain boundary motion.;Czubayko;Acta Materialia,1998

2. Triple junction mobility: A molecular dynamics study.;Upmanyu;Interface Science,1999

3. Molecular dynamics simulation of triple junction migration.;Upmanyu;Acta Materialia,2002

4. On the activation of recrystallization nucleation sites in Cu and Fe.;Lefevre-Schlick;Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2009

5. Triple lines in materials science and engineering.;King;Scripta Materialia,2010

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