A novel rapid cure epoxy resin with internal mold release-Reference-Cited by-同舟云学术

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A novel rapid cure epoxy resin with internal mold release

Published:2021-05-06 Issue:6 Volume:61 Page:1819-1828
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

Reichanadter Alex¹^ORCID,Bank Dave²,Mansson Jan‐Anders E.¹^ORCID

Affiliation:

1. Davidson School of Chemical Engineering Manufacturing Design Laboratory, Purdue University West Lafayette Indiana USA

2. Technical Fellow Midland Michigan USA

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.25703

Reference44 articles.

1. Effects of manufacturing constraints on the cost and weight efficiency of integral and differential automotive composite structures

2. Analytical model for aircraft design based on Design for Excellence (DFX) concepts and use of composite material oriented to automated processes

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sustainably Sourced Tannic Acid Enables Fast-Curing High-Strength Epoxy Adhesives with Increased Toughness;Industrial & Engineering Chemistry Research;2024-07-01

2. Features of polymerization kinetics and heat realize of epoxy resin modified with silicone, silane and siloxane additives;Polymer Bulletin;2024-06-06

3. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04

4. Study on improving the toughness of rapidly curing epoxy resin composite materials with a biobased microcrystalline cellulose;Polymers for Advanced Technologies;2024-03

5. Studies of the Physical Structure of Cured Epoxy Resin Composite Modified with Silicon-Containing Additives;Materials Performance and Characterization;2024-02-12

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