Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Reference9 articles.
1. Microstructure evolution of eutectic Sn-Ag solder joints
2. , and , Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA May, 1–3, 171 (1995).
3. and , Paper presented at the TMS Annual Meeting, 1997.
4. Evaluation of lead-free soldering for automotive applications
5. Study of structural changes and properties for Sn–Zn9lead-free solder alloy with addition of different alloying elements
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献