Author:
Lu Daniel,Sun Yangyang,Wong C. P.
Reference36 articles.
1. Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips;Nishiguchi;IEEE Transactions on Components, Hybrids, and Manufacturing Technology,1991
2. Die Bonding Technology for high performance of LSI Package;Yamazaki,1996
3. Current Die Bonding Technology for Novel Package;Kanno,1998