Improved heat and solvent resistance of a pressure-sensitive adhesive thermally processable by isocyanate dimer dissociation-Reference-Cited by-同舟云学术

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Improved heat and solvent resistance of a pressure-sensitive adhesive thermally processable by isocyanate dimer dissociation

Published:2014-09-30 Issue:6 Volume:132 Page:n/a-n/a
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Asada Kazutaka¹²,Fukano Kenji¹,Yamashita Keiji²,Nakanishi Eiji²

Affiliation:

1. Central Laboratory, Nichiban Co.; Ltd, 3-1-10 Nihongi-shinmachi Anjo City Aichi Prefecture 446-0075 Japan

2. Department of Materials Science and Engineering; Nagoya Institute of Technology, Gokiso-cho, Showa-ku; Nagoya City Aichi Prefecture 466-8555 Japan

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference20 articles.

1. The Macrolattice of a Triblock Polymer

2. Acrylic Block Copolymer for Adhesive Application

3. Katsunori , T. Yasuyuki , I. Hajime , N. Hitoshu , T. 2011 21

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